对标 UL 467 与 IEEE 80 标准,提供高寿命、低阻抗的深地散流解决方案

Molecular-level copper bonding process (Copper-Bonded), combining conductivity with 50-year service life

Advanced ion technology for reduced grounding resistance

Nano-carbon technology for enhanced conductivity

Integrated energy storage and grounding solution

Plate-type grounding electrode for specific soil conditions

Column-type grounding electrode for vertical installations