Petrochemical & Natural Gas

Explosion-proof protection for extreme heat and corrosion, covering refineries and gas facilities

Power & Energy

High-voltage grid and solar grounding systems across deserts and rainforests

Transportation

Zero-interruption operation for cross-border HSR and heavy-haul railways

Infrastructure

System-level protection for commercial centers, stadiums, and data centers

Flagship Technology Solutions

Copper-Bonded Steel Grounding Rod

High-Efficiency Grounding Solution

Core Parameter
Copper Thickness 0.25mm

Perfect combination of high-conductivity copper layer and high-strength steel core, providing durable and reliable grounding performance.

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Copper-Bonded Steel Grounding Rod

Product Introduction

Learn about the core technology advantages of Copper-Bonded Steel Grounding Rod

Green Copper-Bonded Steel Grounding Rod adopts advanced electroplating process to uniformly cover high-purity copper layer on high-quality low-carbon steel core. The copper layer thickness reaches 0.25mm or more, ensuring excellent conductivity and corrosion resistance. The steel core provides strong mechanical strength, enabling the grounding rod to withstand impact force during deep burial installation.

Copper-bonded steel grounding rod is one of the most commonly used grounding materials in modern grounding systems, widely used in power systems, communication base stations, petrochemical industry, building lightning protection and other fields. Compared with pure copper grounding rods, copper-bonded steel grounding rods have higher cost-effectiveness while maintaining good conductivity and corrosion resistance.

Features

  • Copper layer thickness ≥0.25mm, excellent conductivity, stable grounding resistance.
  • Electroplating process, copper-steel molecular bonding, will not peel off.
  • High strength steel core, can be deeply buried, suitable for various geological conditions.
  • Strong corrosion resistance, service life up to 30 years or more.
  • Flexible connection methods, supports exothermic welding, crimping and other connection methods.
  • Complies with UL467, IEC62561 and other international standards.

Electroplating Process

Copper-steel molecular level bonding, ensuring firm bonding between copper layer and steel core, will not peel off

High Conductivity

Copper layer purity above 99.9%, conductivity close to pure copper, stable grounding resistance

Super Corrosion Resistance

Copper layer forms protective film, effectively resisting soil corrosion, service life up to 30 years

Product Models

ModelDiameterLengthCopper ThicknessGrounding Resistance
CBR-14.214.2mm1.2m / 2.4m / 3.0m0.25mm< 0.1Ω
CBR-17.217.2mm1.2m / 2.4m / 3.0m0.25mm< 0.1Ω
CBR-20.020.0mm1.2m / 2.4m / 3.0m0.25mm< 0.1Ω
CBR-25.025.0mm1.2m / 2.4m / 3.0m0.33mm< 0.1Ω

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Copper-Bonded Steel Grounding Electrode/Rod | Earthing / Grounding Systems | Green Electric